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Microstructure and mechanical properties of Ni/Ti/Al/Cu composite produced by accumulative roll bonding (ARB) at room temperature
Ye, Nan1; Ren, Xueping1; Liang, Juhua2
2020-05-01
发表期刊JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
ISSN2238-7854
通讯作者Ren, Xueping(rxp33@ustb.edu.cn)
摘要In this work, the Ni/Ti/Al/Cu composite was produced by accumulative roll bonding (ARB) technology at room temperature. The microstructure evolution and mechanical properties of the composite in the ARB process were investigated by scanning electron microscopy (SEM), energy dispersive spectrometer (EDS), transmission electron microscope (TEM), X-ray diffraction (XRD), micro-hardness and tensile tests. The results showed that a uniform microstructure of the Ni/Ti/Al/Cu composite could be produced by an eight passes ARB process, and no intermetallics were generated at the interfaces. As the ARB pass increased, the thickness of the layers decreased, and the average thickness of Cu layers was 8.5 pm after eight passes. In the ARB process, the average micro-hardness of Ni, Ti, Al, Cu improved from 157.9, 161.3, 23.8, 59.3 HV to 284.3, 254.4, 60.4, 162.2 HV, respectively. Moreover, the micro-hardness was linearly related to the actual equivalent strain. The tensile strength of the composites increased, but the elongation decreased in the ARB process. After eight passes, the tensile strength reached the maximum, which was 298.2 MPa. (C) 2020 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
关键词Ni/Ti/Al/Cu composite Accumulative roll bonding Microstructure Mechanical properties
DOI10.1016/j.jmrt.2020.03.077
关键词[WOS]FRACTURE MECHANISM ; STAINLESS-STEEL ; CU-AG ; EVOLUTION ; ALUMINUM ; FABRICATION ; BEHAVIOR ; ALLOY
收录类别SCI
语种英语
WOS研究方向Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号WOS:000547377300005
出版者ELSEVIER
引用统计
被引频次:35[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.hfcas.ac.cn:8080/handle/334002/102976
专题中国科学院合肥物质科学研究院
通讯作者Ren, Xueping
作者单位1.Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing, Peoples R China
2.Chinese Acad Sci, Inst Solid State Phys, Key Lab Mat Phys, Hefei 230031, Anhui, Peoples R China
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Ye, Nan,Ren, Xueping,Liang, Juhua. Microstructure and mechanical properties of Ni/Ti/Al/Cu composite produced by accumulative roll bonding (ARB) at room temperature[J]. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,2020,9.
APA Ye, Nan,Ren, Xueping,&Liang, Juhua.(2020).Microstructure and mechanical properties of Ni/Ti/Al/Cu composite produced by accumulative roll bonding (ARB) at room temperature.JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,9.
MLA Ye, Nan,et al."Microstructure and mechanical properties of Ni/Ti/Al/Cu composite produced by accumulative roll bonding (ARB) at room temperature".JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T 9(2020).
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