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Microstructure and mechanical properties of Ni/Ti/Al/Cu composite produced by accumulative roll bonding (ARB) at room temperature | |
Ye, Nan1; Ren, Xueping1; Liang, Juhua2 | |
2020-05-01 | |
发表期刊 | JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T |
ISSN | 2238-7854 |
通讯作者 | Ren, Xueping(rxp33@ustb.edu.cn) |
摘要 | In this work, the Ni/Ti/Al/Cu composite was produced by accumulative roll bonding (ARB) technology at room temperature. The microstructure evolution and mechanical properties of the composite in the ARB process were investigated by scanning electron microscopy (SEM), energy dispersive spectrometer (EDS), transmission electron microscope (TEM), X-ray diffraction (XRD), micro-hardness and tensile tests. The results showed that a uniform microstructure of the Ni/Ti/Al/Cu composite could be produced by an eight passes ARB process, and no intermetallics were generated at the interfaces. As the ARB pass increased, the thickness of the layers decreased, and the average thickness of Cu layers was 8.5 pm after eight passes. In the ARB process, the average micro-hardness of Ni, Ti, Al, Cu improved from 157.9, 161.3, 23.8, 59.3 HV to 284.3, 254.4, 60.4, 162.2 HV, respectively. Moreover, the micro-hardness was linearly related to the actual equivalent strain. The tensile strength of the composites increased, but the elongation decreased in the ARB process. After eight passes, the tensile strength reached the maximum, which was 298.2 MPa. (C) 2020 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/). |
关键词 | Ni/Ti/Al/Cu composite Accumulative roll bonding Microstructure Mechanical properties |
DOI | 10.1016/j.jmrt.2020.03.077 |
关键词[WOS] | FRACTURE MECHANISM ; STAINLESS-STEEL ; CU-AG ; EVOLUTION ; ALUMINUM ; FABRICATION ; BEHAVIOR ; ALLOY |
收录类别 | SCI |
语种 | 英语 |
WOS研究方向 | Materials Science ; Metallurgy & Metallurgical Engineering |
WOS类目 | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
WOS记录号 | WOS:000547377300005 |
出版者 | ELSEVIER |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.hfcas.ac.cn:8080/handle/334002/102976 |
专题 | 中国科学院合肥物质科学研究院 |
通讯作者 | Ren, Xueping |
作者单位 | 1.Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing, Peoples R China 2.Chinese Acad Sci, Inst Solid State Phys, Key Lab Mat Phys, Hefei 230031, Anhui, Peoples R China |
推荐引用方式 GB/T 7714 | Ye, Nan,Ren, Xueping,Liang, Juhua. Microstructure and mechanical properties of Ni/Ti/Al/Cu composite produced by accumulative roll bonding (ARB) at room temperature[J]. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,2020,9. |
APA | Ye, Nan,Ren, Xueping,&Liang, Juhua.(2020).Microstructure and mechanical properties of Ni/Ti/Al/Cu composite produced by accumulative roll bonding (ARB) at room temperature.JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,9. |
MLA | Ye, Nan,et al."Microstructure and mechanical properties of Ni/Ti/Al/Cu composite produced by accumulative roll bonding (ARB) at room temperature".JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T 9(2020). |
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