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HFCAS OpenIR  > 技术生物与农业工程研究所
Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions; Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions
Fang, Lingling1; Wang, Yueliang1; Liu, Miao1; Gong, Ming2; Xu, An3; Deng, Zhaoxiang1
2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07 ; 2016-11-07
发表期刊ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION ; ANGEWANDTE CHEMIE-INTERNATIONAL EDITION
摘要Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.; Achieving highly tunable and localized surface plasmon resonance up to near infrared (NIR) regions is a key target in nanoplasmonics. In particular, a self-assembly process capable of producing highly uniform and solution-processable nanomaterials with tailor-made plasmonic properties is lacking. We herein address this problem through a conjunctive use of wet Ag+ soldering and dry thermal sintering to produce nanodimer-derived structures with precisely engineered charge-transfer plasmon (CTP). The sintered dimers are water soluble, featuring gradually shifted CTP spanning an 800 nm wavelength range (up to NIR II). Upon silica removal, the products are grafted by DNA to offer surface functionality. This process is also adaptable to DNA-linked AuNP dimers toward plasmonic meta-materials via DNA-guided soldering and sintering.
文章类型Article ; Article ; Article ; Article ; Article ; Article ; Article ; Article ; Article ; Article ; Article ; Article ; Article ; Article ; Article ; Article
关键词Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Dna Self-assembly Nanodimers Nanodimers Nanodimers Nanodimers Nanodimers Nanodimers Nanodimers Nanodimers Nanodimers Nanodimers Nanodimers Nanodimers Nanodimers Nanodimers Nanodimers Nanodimers Nanoparticles Nanoparticles Nanoparticles Nanoparticles Nanoparticles Nanoparticles Nanoparticles Nanoparticles Nanoparticles Nanoparticles Nanoparticles Nanoparticles Nanoparticles Nanoparticles Nanoparticles Nanoparticles Plasmonics Plasmonics Plasmonics Plasmonics Plasmonics Plasmonics Plasmonics Plasmonics Plasmonics Plasmonics Plasmonics Plasmonics Plasmonics Plasmonics Plasmonics Plasmonics Sintering Sintering Sintering Sintering Sintering Sintering Sintering Sintering Sintering Sintering Sintering Sintering Sintering Sintering Sintering Sintering
WOS标题词Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Science & Technology ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences ; Physical Sciences
DOI10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271 ; 10.1002/anie.201608271
关键词[WOS]SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; SURFACE-ENHANCED RAMAN ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; DISCRETE-DIPOLE APPROXIMATION ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; NANOPARTICLE DIMERS ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; METAL NANOPARTICLES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOSTRUCTURES ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; NANOMATERIALS ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; SCATTERING ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; RESONANCE ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; SPECTROSCOPY ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS ; CLUSTERS
收录类别SCI ; SCI ; SCI ; SCI ; SCI ; SCI ; SCI ; SCI ; SCI ; SCI ; SCI ; SCI ; SCI ; SCI ; SCI ; SCI
语种英语 ; 英语 ; 英语 ; 英语 ; 英语 ; 英语 ; 英语 ; 英语 ; 英语 ; 英语 ; 英语 ; 英语 ; 英语 ; 英语 ; 英语 ; 英语
项目资助者NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; NNSFC(21425521 ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; MOST of China(2016YFA0201300) ; 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Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; 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Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Hefei Center for Physical Science and Technology(2014FXCX010) ; Collaborative Innovation Center of Suzhou Nano Science and Technology ; Collaborative Innovation Center of Suzhou Nano Science and Technology ; Collaborative Innovation Center of Suzhou Nano Science and Technology ; Collaborative Innovation Center of Suzhou Nano Science and Technology ; Collaborative Innovation Center of Suzhou Nano Science and Technology ; Collaborative Innovation Center of Suzhou Nano Science and Technology ; Collaborative Innovation Center of Suzhou Nano Science and Technology ; Collaborative Innovation Center of Suzhou Nano Science and Technology ; Collaborative Innovation Center of Suzhou Nano Science and Technology ; Collaborative Innovation Center of Suzhou Nano Science and Technology ; Collaborative Innovation Center of Suzhou Nano Science and Technology ; Collaborative Innovation Center of Suzhou Nano Science and Technology ; 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WOS研究方向Chemistry ; Chemistry ; Chemistry ; Chemistry ; Chemistry ; Chemistry ; Chemistry ; Chemistry ; Chemistry ; Chemistry ; Chemistry ; Chemistry ; Chemistry ; Chemistry ; Chemistry ; Chemistry
WOS类目Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary ; Chemistry, Multidisciplinary
WOS记录号WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015 ; WOS:000387028000015
引用统计
被引频次：36[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.hfcas.ac.cn:8080/handle/334002/30155
专题技术生物与农业工程研究所
作者单位1.Univ Sci & Technol China, CAS Key Lab Soft Matter Chem, Hefei 230026, Anhui, Peoples R China
2.Univ Sci & Technol China, Engn & Mat Sci Expt Ctr, Hefei 230027, Anhui, Peoples R China
3.Chinese Acad Sci, Hefei Inst Phys Sci, Key Lab Ion Beam Bioengn, Hefei 230031, Anhui, Peoples R China
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GB/T 7714		 Fang, Lingling,Wang, Yueliang,Liu, Miao,et al. Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions, Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions[J]. ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION,2016, 2016, 2016, 2016, 2016, 2016, 2016, 2016, 2016, 2016, 2016, 2016, 2016, 2016, 2016, 2016,55, 55, 55, 55, 55, 55, 55, 55, 55, 55, 55, 55, 55, 55, 55, 55(46):14294-14298, 14294-14298, 14294-14298, 14294-14298, 14294-14298, 14294-14298, 14294-14298, 14294-14298, 14294-14298, 14294-14298, 14294-14298, 14294-14298, 14294-14298, 14294-14298, 14294-14298, 14294-14298.
APA Fang, Lingling,Wang, Yueliang,Liu, Miao,Gong, Ming,Xu, An,&Deng, Zhaoxiang.(2016).Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions.ANGEWANDTE CHEMIE-INTERNATIONAL EDITION,55(46),14294-14298.
MLA Fang, Lingling,et al."Dry Sintering Meets Wet Silver-Ion "Soldering": Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions".ANGEWANDTE CHEMIE-INTERNATIONAL EDITION 55.46(2016):14294-14298.
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