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Fabrication of Thermal Conductivity Enhanced Polymer Composites by Constructing an Oriented Three-Dimensional Staggered Interconnected Network of Boron Nitride Platelets and Carbon Nanotubes
Su, Zheng1,3; Wang, Hua1,2; He, Jing1,3; Guo, Yulan1,3; Qu, Qiqi1,3; Tian, Xingyou1,2
2018-10-24
Source PublicationACS APPLIED MATERIALS & INTERFACES
ISSN1944-8244
Corresponding AuthorWang, Hua(wanghua@issp.ac.cn) ; Tian, Xingyou(xytian@issp.ac.cn)
AbstractThe orientation of ultrahigh aspect ratio thermally conductive fillers can construct a heat transfer path to enhance the thermal conductivity of composite materials effectively with low filler loading. Nevertheless, single orientation (vertical or horizontal) limited the application of these materials when there was the need for isotropic heat transferring. Here we report a novel strategy to prepare thermally conductive flexible cycloaliphatic epoxy resin nanocomposites with an oriented three-dimensional staggered interconnected network of vertically aligned h-BN (hexagonal boron nitride) platelets and randomly dispersed CNT-NH2 (aminated carbon nanotubes). In this structure, h-BN platelets coated with magnetic particles could respond to the external magnetic field; however, the CNT-NH2 couldn't. The obtained composites exhibited both through-plane (0.98 +/- 0.037 W/m.K) and in-plane (0.99 +/- 0.001 W/m.K) thermal conductivity enhancement at low h-BN loading of 30 wt %, and also presented excellent electrical insulating properties (<1.2 X 10(-12) S/cm). In addition, the equal value of thermal conductivity of two directions (in-plane and through-plane) was shown when the content of h-BN was about 26.43 wt % and of CNT-NH2 was 2 wt %, displaying no difference between the thermal conductivity of two directions (in-plane and through-plane). The infrared imaging tests showed the outstanding heat dissipation capability of the composites by capturing the surface temperature variations of a heater with the composites as the heat dissipating material.
Keywordpolymer-matrix composites thermal conductivity hexagonal boron nitride carbon nanotube
DOI10.1021/acsami.8b09703
WOS KeywordELECTRONIC ENCAPSULATION ; GRAPHENE ; NANOCOMPOSITES ; FUNCTIONALIZATION ; PERFORMANCE ; MANAGEMENT ; NANOSHEETS ; TRANSPORT ; ALIGNMENT ; MATRIX
Indexed BySCI
Language英语
Funding ProjectNational Key R&D Program of China[2017YFB0406200] ; Strategic Priority Research Program of the Chinese Academy of Sciences[XDA13040505] ; Science and Technology Service Network Initiative of the Chinese Academy of Sciences[KFJ-STS-SCYD-112] ; key deployment project of the Chinese Academy of Sciences[KFZD-SW-416] ; Science and Technology Cooperation Project of Sichuan Province ; Chinese Academy of Sciences[2017JZ0028] ; National Key R&D Program of China[2017YFB0406200] ; Strategic Priority Research Program of the Chinese Academy of Sciences[XDA13040505] ; Science and Technology Service Network Initiative of the Chinese Academy of Sciences[KFJ-STS-SCYD-112] ; key deployment project of the Chinese Academy of Sciences[KFZD-SW-416] ; Science and Technology Cooperation Project of Sichuan Province ; Chinese Academy of Sciences[2017JZ0028]
Funding OrganizationNational Key R&D Program of China ; National Key R&D Program of China ; National Key R&D Program of China ; National Key R&D Program of China ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Science and Technology Service Network Initiative of the Chinese Academy of Sciences ; Science and Technology Service Network Initiative of the Chinese Academy of Sciences ; Science and Technology Service Network Initiative of the Chinese Academy of Sciences ; Science and Technology Service Network Initiative of the Chinese Academy of Sciences ; key deployment project of the Chinese Academy of Sciences ; key deployment project of the Chinese Academy of Sciences ; key deployment project of the Chinese Academy of Sciences ; key deployment project of the Chinese Academy of Sciences ; Science and Technology Cooperation Project of Sichuan Province ; Science and Technology Cooperation Project of Sichuan Province ; Science and Technology Cooperation Project of Sichuan Province ; Science and Technology Cooperation Project of Sichuan Province ; Chinese Academy of Sciences ; Chinese Academy of Sciences ; Chinese Academy of Sciences ; Chinese Academy of Sciences ; National Key R&D Program of China ; National Key R&D Program of China ; National Key R&D Program of China ; National Key R&D Program of China ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Science and Technology Service Network Initiative of the Chinese Academy of Sciences ; Science and Technology Service Network Initiative of the Chinese Academy of Sciences ; Science and Technology Service Network Initiative of the Chinese Academy of Sciences ; Science and Technology Service Network Initiative of the Chinese Academy of Sciences ; key deployment project of the Chinese Academy of Sciences ; key deployment project of the Chinese Academy of Sciences ; key deployment project of the Chinese Academy of Sciences ; key deployment project of the Chinese Academy of Sciences ; Science and Technology Cooperation Project of Sichuan Province ; Science and Technology Cooperation Project of Sichuan Province ; Science and Technology Cooperation Project of Sichuan Province ; Science and Technology Cooperation Project of Sichuan Province ; Chinese Academy of Sciences ; Chinese Academy of Sciences ; Chinese Academy of Sciences ; Chinese Academy of Sciences
WOS Research AreaScience & Technology - Other Topics ; Materials Science
WOS SubjectNanoscience & Nanotechnology ; Materials Science, Multidisciplinary
WOS IDWOS:000448754500074
PublisherAMER CHEMICAL SOC
Citation statistics
Cited Times:31[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.hfcas.ac.cn:8080/handle/334002/39883
Collection应用技术研究所
Corresponding AuthorWang, Hua; Tian, Xingyou
Affiliation1.Chinese Acad Sci, Hefei Inst Phys Sci, Inst Appl Technol, Hefei 230031, Peoples R China
2.Chinese Acad Sci, Key Lab Photovolta & Energy Conservat Mat, Hefei 230031, Peoples R China
3.Univ Sci & Technol China, Hefei 230036, Anhui, Peoples R China
Recommended Citation
GB/T 7714
Su, Zheng,Wang, Hua,He, Jing,et al. Fabrication of Thermal Conductivity Enhanced Polymer Composites by Constructing an Oriented Three-Dimensional Staggered Interconnected Network of Boron Nitride Platelets and Carbon Nanotubes[J]. ACS APPLIED MATERIALS & INTERFACES,2018,10(42):36342-36351.
APA Su, Zheng,Wang, Hua,He, Jing,Guo, Yulan,Qu, Qiqi,&Tian, Xingyou.(2018).Fabrication of Thermal Conductivity Enhanced Polymer Composites by Constructing an Oriented Three-Dimensional Staggered Interconnected Network of Boron Nitride Platelets and Carbon Nanotubes.ACS APPLIED MATERIALS & INTERFACES,10(42),36342-36351.
MLA Su, Zheng,et al."Fabrication of Thermal Conductivity Enhanced Polymer Composites by Constructing an Oriented Three-Dimensional Staggered Interconnected Network of Boron Nitride Platelets and Carbon Nanotubes".ACS APPLIED MATERIALS & INTERFACES 10.42(2018):36342-36351.
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