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Thermal Analysis of Water-Cooled Heat Sink for Solid-State Circuit Breaker Based on IGCTs in Parallel 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 卷号: 9, 期号: 3, 页码: 483-488
作者:  Wang, Shusheng;  Song, Zhiquan;  Fu, Peng;  Wang, Kun;  Xu, Xuesong;  Tong, Wei;  Wang, Zhongma
浏览  |  Adobe PDF(1771Kb)  |  收藏  |  浏览/下载：93/44  |  提交时间：2020/07/14
Thermal resistance  water-cooled heat sink  integrated gate-commutated thyristors (IGCTs)  solid-state circuit breaker (SSCB)